base material: FR4, FR1, FR2, CEM-1, CEM-3 Layer: 2-22 layer Board thickness: 0.30 to 3.20mm (12 to 26mil) Copper thickness: 0.50 to 5 ounce Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask Minimum line width: 3milMinimum line space: 3milMinimum hole diameter: 0.25mm (10mil) PTH hole diameter tolerance: +/-0.076mm (+/-3mil) NPTH hole diameter tolerance: +/-0.03mm (+/-1.2mil) Maximum board size: 460 x 620mm (18 x 24) Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers