Board Thickness 0.8mm
Min. Hole Size 0.1mm
Min. Line Width 4mil
Min. Line Spacing 4mil
Surface Finishing immersion gold
Color green
Technology immersion gold

1. PCB size 80 *41 mm 2. PTH Hole Dia Tolerance < 0.8+-0.076mm>
3. Hole Position Deviation +-0.05mm
4. Insulation Resistance >10Ω
5. Throngh Hole Resistance <300uΩ
6. Dielectric Strength >1.6Kv/mm
7. Peel-off Strength 1.5N/mm
8. Solder Mask Abrasion >5H
9. Thermal Stress 288° C
10. Flammability 96V-0
11. Solderability 235° C
12. Board Twist <0.01mm/mm
13. LonicContamination <1.56ug/cm2
14. Copper Thickness 1.5o z
15. Board Twist 25um,
16. Material FR-4 CEM-3