Our 15 years' manufacturing experience, the use of Laser-direct Imaging, Laser drilling and contouring, high layer count lamination processing equipment, Pulse plating and other specialized equipment factory-wide enables Ausay to Produce 40 layer and above rigid boards and rigid-flex circuits up to 20 layers.

Backplane thicknesses up to. 276 (7mm), aspect ratios up to 20: 1, 2/2 line/space
And impedance controlled designs are produced daily.
Layers count: 2- 40
Min Line width/spacing(mil): 2.5/2.5
Max Aspect Ratio: 22: 1
Board thickness: 0.13-7.0mm
Max Panel size: 23"x35"
Material: FR-4, High Tg FR-4, Halogen free, High Frequency
(Rogers, Arlon, Taconic, Nelco...)etc.
Surface Treatment: HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Flash Gold, Golden Finger, OSP, Lead free HASL etc.