base Material T-101, T-110, T-111, T-112, T-511, T-512
Copper Thickness H 1 2 3 4 6 10 (oz)
Board Thickness 0.5-5.0mm
Min. Hole Size 0.5mm(NPTH), 0.3mm(PTH)
Min. Line Width 0.1 (mm)
Min. Line Spacing 0.1 (mm)
Surface Finishing OSP, HASL, Immersion Gold
Certificate TS16949, ISO14001
UL Certificate No.: E313154
SGS Test Report SGS Report No.: CANEC0806700202

1. Surface Treatment ---- HASL, Flash gold Immersion Gold/Nickle, OSP
2. Number of Layer ----- Single Sided, Two-sided and multilayer, Special layer
3. Max. PCB Size ----- 580mm× 460mm
4. PCB Thickness ----- 0.5-5.0mm
5. Copper Foil Thickness ----- H 1 2 3 4 6 10 (oz)
6. Insulating Layer Thickness ----- 50 75 100 125 150 (um)
7. metal base Type ----- Al(1100, 5052, 6061), Cu, Fe, Stainless Steel etc.
8. metal Substrate ----- 0.5 0.8 1.0 1.2 1.5 2.0 3.0 3.2 (mm)
9. Shaping ----- Die PunchingStampingRouteV-Cut
10. Solder Mask Colour ----- GreenWhiteBlackRedYellow
11. The Minimum Letter Height ----- 0.8 (mm)
12. The Minimum Letter Line Width ----- 0.15 (mm)
13. The Minimum Line Width ----- 0.15 (mm)
14. The Minimum Line Spacing ----- 0.15 (mm)
15. The Minimum Hole Diameter ----- 0.5 (mm)
16. Special hole ----- Spot facing, , cup hole
17. File Format ----- Gerberprotelpowerpcbactocad.