1. Layer count: 10 layers (HDI board)
2. Board thickness: 1.60mm
3. Material type: FR-4 94V0 Tg>=135°
4. Outer/Inner copper thick: 1oz/ Hoz
5. Min. Line width/space: 4mil/4mil
6. Min. Hole diameter: 10mil
7. Solder resist: LPI green
8. Silkscreen color: White
9. Surface treatment: ENIG
10. Application scope: Industrial control product
11. Special note:
1). RoHS conformed
2). Buried/blind hole dia.: 8mil/4mil
12. Figuration: Routing+V-CUT