Technical Parameter≥
1. Basis brasses: Oxygen-free copper wire planish(interconnect strip)T2 copper belt divide&cut (busbar)
2. Basis brasses electrical resistivity: Oxygen-free cooper wire≤ 0.0165Ω Mm2/m. T2 Copper belt ≤ 0.0172Ω Mm2/m
3. Solder tin component: 63%Sn 37%Pb 62%Sn 36%Pb 2% AG 99%Sn 1% AG 96.5%Sn 3.5%AG
4. Solder tin melting point: 180-224º C
5. Tin thickness: One-side coated≥ 0.02mm
6. Extensibility: Soft phase≥ 20% semi-soft phase≥ 15%
7. Breadth error: ± 0.1mm Thickness error: ± 0.02mm
8. Packing: Paper disk, ABS cylinder. Paper tray