Advantages as follows:
1. OEM service
2. Lead time of samples: 15-30 days
3. Mass production: Within 4-6weeks
4. FedEx, UPS DHL, EMS are available
5. FPC can be packed with plastic packaging

Product Range for your information:
Single sided up to 16-Layer PCB
Blind & buried vias
HDI capable - down to min. 3 mil LW
Heavy copper capable
RF board capable
Ceramic board capable
Surface treatment - RoHS compliant option available
- HASL
- Lead Free HASL
- ENIG
- Immersion Tin/Silver/Gold
- Plating Gold
- Gold Finger
- OSP

Spec as follows for your information:
Mass production Sample
1. Max Dimension: 630x530mm 630x530mm
2. Copper thickness of inner layer: 18-140um 18-210um
3. Copper thickness of outer layer: 12-210um 12-210um
4. Min. Annular ring: 0.10mm 0.08mm
5. Min. Solder mask clearance: 0.05mm 0.05mm
6. Min. Solder mask clearance: 0.045mm 0.03mm
7. Impedance tolerance: ± 10% ± 8%
8. Finished board thickness: 0.25mm-3.5mm 0.20mm-4.0mm
9. Outline precision: ± 0.1mm ± 0.08mm
10. Layers No.: 2-12layers 2-14layers
11. Inner layer circuit: 4/4mil 4/3mil or 3/4mil
12. Out layer circuit width/spacing: 4/4mil 4/3mil or 3/4mil
13. Board Thickness: 0.1-1.6mm 0.075-1.6mm
14. Min. Drill bit size: 0.2mm 0.15mm
15. Surface Finished type: HASL, Flash golds, ENIG, OSP(lead freecompatible), Carbon ink, Peelable S/M, HASL(lead free), Immersion silver/tin, Gold finger plating, ENIG+gold finger plating, Immersion Silver+gold finger plating
16. Production type: High precision multi-layer board, Blind hole board, Buyerd hole board, High frequency board, Aluminium backed board
17. base Material: FR-4, Aluminium-backed board, Halogen-free, Lead-free compatible, High Tg, High CTI, CEM-1, CEM-3 etc.
18. Certificate: ISO9001. UL SGS etc