Our factory capability and technology

1. Material:
FR4 (Normal and High TG)/CEM-3/PTHE Aluminum-base/Rogers /Halogen Free/Rogers/Ferrum^

2. Layer Counts: 2 to 24 layers are available;

3. Finished Borad Thickness:
3.1 Finished Board Thickness: Two-layer P. C. B.: 0.2mm~3.2mm; Multi-layer P. C. B.: 0.6mm~5.0mm;
3.2 Board Thickness Tol: +/-10%;

4. Finished Copper Thickness
Inner: 17um~190um; Outer: 35um~190um;

5. Drilling/Holes
5.1 Hole Position Tol: ± 0.075mm;
5.2 Hole Size Tol (+/-): PTH: ± 0.075mm; NPTH: ± 0.05mm;

6. Plating
6.1 Copper PTH: 18-40um;
6.2 HASL(LF): 2.5UM; ENIG-NI: 3-7um; Au: 1-5u''; OSP: 0.2-0.5um;

7. S/M and Silkscreen Ink:
7.1 S/M Color: Green/Matte Green, Black/Matt Black, Red, Yellow, Blue, and so on; (S/S; D/S)
7.2 Min S/M Dam: 0.1mm
7.3 Min S/M Clearance: 0.05mm;
7.4 Silkscreen/Legend Color: Normal: White; (S/S; D/S)

8. Surface Treatment:
8.1 HASL(Lead Free), Immersion Silver, Immersion Tin, Gold Finger, Flash Gold Plating, OSP,
8.2 ENIG(Immersion Gold): Au Thickness: 0.0762um~0.762um; Ni Thickness: 0.0254um~0.127um;

9. Outline/Profiling
Panel Outline Tol: +/-0.13mm;
Bevelling: 30° 45° ; Gold Finger Angle: 15° 30° 45° 60°

10. Certificate: RoHS, ISO9001: 2008, SGS, UL certificate.

11. Speciality:
Spacial Process: Blind/Buried Via, HDI Microvia, Rigid Flex.
Special Offer: Quick-turnaround PCB.