8layers mobilephone mainboard,

OEM products are high welcomed:
Layer: 1-20 layers
Material: Fr4, cem1, cem3, fr2, aluminium base, copper thickness: 1/3oz-4oz
Board thickness: 0.15-3.2mm
Min line width/spacing: 0.1/0.1mm
Min drilling hole size: 0.20mm
Advanced technologies: Blind/buried via, hdi micro via
Surface finishing: Hal, hal(lead-free), gold plating, immersion gold/sliver/tin, enig, osp
Certificates: ISO9001, UL, RoHS