Form-In-Place Gakseting technology, so-called FIPG, is using an automated system to dispense conductive silicone elastomer onto metal or plastic substrates as EMI shielding and grounding gaskets. This technology is particularly well suited for cellular phones, PDAs, PC cards, telecom base stations, and many other cast or plastic enclosures.

Utilizing programmable 3-axis CNC dispensing equipment, the compounds is dispensed accurately onto the substrate and creates a secure bond during the curing process. The repeatable computer-controlled dispensing pattern insures consistency between parts and rapid part program changes. In addition, it supports all levels of volume ??from prototyping to mass production, via the use of one or multiple dispensing heads.