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A. Fully-encapsulated printed circuit board being able to be directly welded and assembled. Easy to use, perfect outline;
B. Compact in structure, solid, vibration-proof, moisture-proof, flame-resistant, and high dielectric strength;
C. Low idle current, high power factor, good over input voltage capacity;
D. Compared with T Series, higher reliability, and better adaptability of the environment;
E. Built-in temperature protector, safer in application.


