6" Multi Wafer Specification
Edge Defect Length≤ 5mm, depth≤ 0.5mm (Max 1 PCS/w)
Saw mark ≤ 30μ M (depth)
Crack and pin holes No cracks and pin holes
Micro-crack, pitting holes and inclusions No non-penetrating & penetrating micro crack, inclusions and holes
Surface cleanliness As cut and cleaned, No stains, scratch, contamination, watermark and fingerprints
Angle between square sides 90± 0.3 deg.
Bevel edge width (hypotenuse) 0.5~2 mm
Bevel edge angle 45± 10 deg.
Length of wafer edge 156± 0.5mm
Thickness 200 ± 20μ M
TTV ≤ 50μ M
Bow ≤ 70μ M
Warp / Warpage <70μ M
Dopant P
Resistivity 0.5 ~ 3.0Ω /cm
Lifetime 2.0μ M(Brick level)
We can supply 156 * 156, Multi Wafer, produced in Taiwan, 13.5 yuan/piece. If need to the detailed specification please inform E-mail or fax.