XCG63-B1
Double Head COG Bonding M/C

Application:
The machine is used for bonding IC driver onto various LCD glasses.

Technic Application: STN CSTN TFT

Key Feature:
A. Double cylinders of SUNSOM pressure system can eliminate self-gravity of bond head, minimum pressure accuracy is 0.1kg.
B. Two sets precise slide rail of SUNSOM bond head position, linear bearing assist position, applied to various high precision product bonding.
C. Top and bottom constant temperature heating and four temperature controlling system meet to diversified product bonding.
D. Auto rolling and double fixtures fixed work greatly improve accuracy and efficiency.
E. Concave structure of pre-bonding head, imported high rigid bond head, ensure product bonding efficiency.

Basic Parameter
Voltage: AC220V 50-60Hz
Rating Power: 1.5KW
Pressure: 0.4-0.8Mpa
Work Mode: Double stations fixed work
Operation Mode: 7" interface
Program Control: PLC controller
Bond Head: 60x5mm(customization)
Stored Parameter: 50 sets
Rolling Mode: Auto
Pressure: 0.01-0.8MPA
Thermocouple: K type
Heat Mode: Constant heat
Weight: 260kg
Dimension: L950 x W535 xH1285mm

Front View and Side View

Machine parameter and specification made to customer request