General Info.
1: Raw Material:
Housing/base Material: OFHC, Tungsten Copper, Molybdenum, GLIDCOP
Pin Material: Copper Cored Alloy52/Kovar, OFHC, ZrCu
2: BeO substrate Configuration: W85Cu15+BeO; W85Cu15+BeO+Mo; OHFC+Mo+BeO+Mo.
3: High Reliability, used at high temperature of 450 degree C
4: Special Seal techniques, pin can be sent within 45 degree and go back to its original position without causing any reliability issue.
5: Manufacturing Standard: China Military Standard GJB923A-2004 (MIL-STD-19500) and Screened per MIL-PRF-38354