Model:0.22
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The diamond wire saw is the latest technology for slicing large diameter wafers used in semiconductor as well as photovoltaic.
Wire Saws for Semiconductor cutting 0.22mm
2016-10-24 11:49 Views:189
Price:Negotiable
Model:0.22
Model:0.22
Contact Infomation
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Company name:Tianjin Mande Industry & Trade Co., Ltd.
Status:[Offline] [Send message] [Chat]
Business contact:Jane Wei(Mr.)
Telphone:
Mobile:
Fax:
Area: Caribbean Region-Bermuda
Address:Gate 1-902 No.3 Dongrunmingdi liuwei Road Dazhigu Hedong Dist Tianjin
Status:[Offline] [Send message] [Chat]
Business contact:Jane Wei(Mr.)
Telphone:
Mobile:
Fax:
Area: Caribbean Region-Bermuda
Address:Gate 1-902 No.3 Dongrunmingdi liuwei Road Dazhigu Hedong Dist Tianjin