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Lead Free process Double-side SMT + Thru-hole
High-speed Pick & Place + Wavesolder
Quick turn & Prototyping our specialty
Design Review for Manufacturability
Flex Circuit Assembly
µBGA, CSP, BGA attach to 0.50 mm max size
Fine-pitch SMT, QFP down to 16 mil pitch
Pick & Place 0402 components
Small Parts Assembly and Soldering
Rework, Parts Recovery, Rebuild
Connector and terminal press-fit capability
Water Soluble processes + Aqueous Cleaning
Consignment,Turnkey Service
