Brand:FSE
Quantity:100
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*. Two independent heating zones, multitude temperature zones control, lead free process.*. Top heating zone use to infrared
*. The bottom zone applies to far infrared to pre-heating to prevent PCB curve.
*. Six-section temperature controls, simulates re-flower effect completely.
*. Cooling PCB after heating, to prevent PCB deformation.
*. BGA welding on completion of the demolition, a voice prompt
*. Vacuum wand sucks BGA, convenient, reliable and durable
*. Card board with a special tooling for a wide variety of notebook motherboard(option )
*. COM connection, connect with computer to achieve hi-end rework function.
