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DescriptionThe Polyimide FPC Film is synthesized by polymerizing an aromatic dianhydride and an aromatic diamine. It has an excellent balance of electrical, thermal, mechanical, physical, and chemical properties over a wide temperature range (from-269 (-452) to 400 (752)). In particular, it is high-temperature resistant and exhibits excellent thermal stability.
Application
The Polyimide FPC Film can be used in flexible printed circuit board (FPC), electric insulation material for cables and coils, electrical motors for high-temperature applications, as well as other adverse working conditions thanks to its superior stability and strength.
