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Layer: 1-40;Board Material: FR4, High Tg, Aluminum base, High Frequency, Rogers,PTFE,FPC,Thick Copper, Paper base, BT base, PI base, Rogers, Arlon, Nelco ;
Product type: Back board, HDI, Blind/Burried vias multilayer, Capacitor Embedded board, Power supply, Thick gold, Thick copper board, etc.
Min Trace/Space: 0.050mm(2mils) Finished copper weight 0.5 OZ;
Min. Annular Ring Width: Vias: 3mils, Component Holes: 5mils;
Min. Hole Size: NC drill 0.10mm(4mil); Laser drill 0.10mm(4mil)(Depth=65um)
