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Multilayer standard up to 20 layersFR-4, Tg170, Rogers
Copper thickness: 0.5-3 oz
Board thickness: 0.4-3.2mm
Tracks and gaps standard >= 0.1mm
Surface finish: OSP,HASL(leaded or unleaded), Immersion gold, Plate gold
Ball Grid Arrays
High-density Multilayer pcb
2017-01-12 05:22 Views:244
Price:Negotiable
FR-4, Tg170, Rogers
Copper thickness: 0.5-3 oz
Board thickness: 0.4-3.2mm
Tracks and gaps standard >= 0.1mm
Surface finish: OSP,HASL(leaded or unleaded), Immersion gold, Plate gold
Ball Grid Arrays
FR-4, Tg170, Rogers
Copper thickness: 0.5-3 oz
Board thickness: 0.4-3.2mm
Tracks and gaps standard >= 0.1mm
Surface finish: OSP,HASL(leaded or unleaded), Immersion gold, Plate gold
Ball Grid Arrays
Contact Infomation
Send Inquiry
Company name:XingZhiGuang Technology International Co., Ltd
Status:[Offline] [Send message] [Chat]
Business contact:Sophie Chan(Mr.)
Telphone:
Area: Caribbean Region-Bermuda
Address:New Lilin Development, Lilin Town, Huizhou City, GuangDong, China.
Status:[Offline] [Send message] [Chat]
Business contact:Sophie Chan(Mr.)
Telphone:
Area: Caribbean Region-Bermuda
Address:New Lilin Development, Lilin Town, Huizhou City, GuangDong, China.