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Aluminum copper clad laminate sheetAL base thermal conductive CCL provides the advantages of high thermal conductivity, Excellent solder heat endurance, Excellent Breakdown Voltage, reliability, Thermal conductivity is about five-ten times higher than the FR-4, PCB produced by the subtract can transfer heat, which is electronic components generate, throughing the substrate structure rapid conduct to the back-end cooling base or other cooling modules. Aluminum Copper Clad Laminate Sheet is a sandwich structure, which includes layers of conductor, insulator and metal base. In general, this insulator is made of epoxy resin and high thermal Conductivity filler. The products have been through a number of demanding for a long time environmental testing, access to international certification.
