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PCB assembly,PCBA,SMT,DIP process.Technical requirement:
1) Surface-mounting Technology(SMT) and Through-hole/DIP
2) 0201,0402,0603 size components SMT technology and lead free technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) UL,CE,FCC,Rohs standard
5) With IPC-610D manufacturing and other international standards.
6) Nitrogen gas reflow soldering technology for SMT.
7) High density interconnected board placement technology capacity.
