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Lead Solder Paste? Excellent printability, eliminate the omission, sag and caking phenomenon in the process of printing.
? Good wettability ,bright spot, full, evenly.
? Generated solder beads rarely when reflowed ,effectively improve the occurrence of short circuit.
? After the printing on the PCB still can maintain its viscosity for a long time
? Suitable for different reflow machine, different temperature curves.
