Brand:Hitech PCB
Quantity:50000
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10L High density PCB (HDI PCB)Layer Count: 10-layers (HDI PCB with3+4+3 stack up)
Mobile Phone main board
Finish board thickness: 1.0mm
Material: FR4, Tg150
Surface finishing: immersion gold+OSP
Line width and space: 0.13/0.13mm
Special technology: HDI PCB with 3 + 4 + 3 Layers, 4mil Blind and 12mil Buried Via
Impedance control tolerance: +/-8%
Through hold size: 0.3mm
