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Layer:2 Board thickness:2.0mm
Copper thickness:3oz(105µm)
Board material: FR4 Normal TG140
Surface finishing:immersion tin
Min line width:0.15mm
Min line space:0.3mm
Min hole size:0.3mm
Min. Copper thickness in hole wall: 20µm
solder mask: green
Legend:White
100% E-Test
IPC class 2
RoHS
